Fully Automatic Wafer Wax Mounter

Wax Mounter is primarily used for bonding one side of wafers, such as gallium nitride (GaN), gallium arsenide (GaAs), sapphire, and silicon carbide (SiC), to ceramic carrier prior to single-sided grinding and CMP polishing. The equipment integrates the processes of loading, transporting, heating, waxing, cooling, and pressing into a fully automated system, simplifying the wafer wax mounting process and improving the yield.

Engineering Intents

Achieves fully automated bonding: heating, waxing, mounting, chilling
3 independent temperature-controlled workstations
Independent wafer tray to prevent burns
Water-chilled pressurized cooling tower
Wafer handling robot with vacuum suction cups
Carrier handling robot

Specifications

Machine Model	Unit	PDM 305 AW	PDM 360 AW	PDM 420 AW	PDM 585 AW
Lapping (Polishing) Disc Diameter	pcs	10	12	-
Capacity of 4-inch (50 mm)	-	5	6	7	11
Capacity of 6-inch (150 mm)	-	1	3	4	7
Capacity of 8-inch (200 mm)	-	1	1	3	5
Ceramic Carrier Diameter	mm	305	360	420	585
Carrier Heating Range	°C	60 – 180
Wax Heating Temperature	°C	100 ± 3
Heating Duration (130 ± 3 °C)	sec	230	260	295	385
Chilling Duration (30 ± 3 °C)	sec	140	165	195	270
Temperature Control Accuracy	°C	± 3
Compress Pressure (0.6 MPa)	kgf	200 ± 3	250 ± 3	305 ± 3	455 ± 3
Bonding TTV	µm	≤ 5
Wax Dispensing Accuracy	g	± 0.2
Total Power	kVA	7	10	14	26
Total Weight	kgf	1050	1120	1200	1450
Dimension (W×D×H)	mm	1550×1550×1900		2150×2050×1990

Model Defination

PDM	Wafer Mounter
305 · 360 · 420 · 585	Max. Clamping Diameter
A	Fully Automatic
W	Wax Mounter

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