Wafer Grinding Machine
Precision grinding and CMP finishing for uniform, defect-free wafers
Explore Wafering Machines
Lapping & Polishing Machine
Consistent flatness, parallelity and mirror-like surface finishes
Discover Lapping & Polishing Machines
Advanced Processing Techniques
Plenty of grinding and polishing solutions for various industries
Our Processing Solutions
Precision grinding of semiconductor wafers

Wafering

Grinding, CMP, beveling, and wax bonding machines for semiconductor wafers.

large-scaled spherical lens grinding process

Optics Surfacing

Multi-axis grinding and polishing machines for spherical and aspherical lenses.

gears are being lapping with circular diamond lapping disc

Flat Lapping & Polishing

Single-sided and double-sided flat surface lapping and flattening machines.

Wafer CMP polisher equipment in operation

CMP Polishing

Single-sided and double-sided polishers for defect removals and surface finishes.

Featured Technology

Wafer as thin as 5 microns

Secure wafer handling

Axial runout 0.05 micron

For complex asphere

Recondition lapping discs

Industry Applications

Automatic wafer grinding

Semiconductor

Wafer grinding, flattening and CMP for thinning and surface finishing.

Automatic wafer grinding

Optical Lens

Optical grinding and polishing for spherical and aspherical parts.

Automatic wafer grinding

Measurement Parts

Dimensional control for measurement instrument components.

Automatic wafer grinding

Sealing Components

Surface flattening and finishing for sealing components.

Automatic wafer grinding

Mechanism

Surface flattening and finishing for mechanical components.

Automatic wafer grinding

Electronic Device

Surface finishing for electronic components and device refurbishment.

Automatic wafer grinding

Medical Instruments

Surface finishing for medical device components and implants.

Automatic wafer grinding

Vehicle Components

Size control and surface finishing for vehicle components.

Automatic wafer grinding

Energy Components

Grinding and polishing for energy-efficient industrial components.

About us

PONDA GRINDING specializes in the production of high-precision grinding, lapping, and polishing equipment and consumables. Our products are widely used in the precision machining of various industries, including semiconductors, optics, smartphone hardware, mechanical sealing, aerospace, aircraft, and automotive, among others.

At Ponda, we have established a solid foundation of core technology, which gives us the confidence to engage with customers, academic institutions, and investors. Our commitment to innovation and excellence has positioned us as a leading provider of precision machining solutions.

Technical Support

We offer permanent free technical support. Our team is always available to help maximize your equipment's performance and longevity.

Worldwide Service

Our after-sale team is ready to provide on-site service worldwide. Trust us for expert handling of your equipment's needs, wherever you are.

Extensive Experience

With more than 20 years in grinding, we understand your needs. Our expertise ensures optimal equipment performance and reliability.

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