Engineering Intents
- Laboratory-friendly equipment size
- Cast iron and marble combined machine body
- Configurable with either a high-precision mechanical spindle or an aerostatic grinding spindle
- Spindles of different power are configured for different materials
- The worktable can clamp up to 3 different sizes of wafers
- High stability enables a minimum grinding thickness of 5 micrometers
Specifications
| Specification | Unit | PDG 1100 SAT | PDG 1150 SAT | PDG 1200 SAT | PDG 1300 SAT |
|---|---|---|---|---|---|
| Max. Clamping Diameter | mm (inch) | 100 (4) | 150 (6) | 200 (8) | 300 (12) |
| Grinding Wheel Diameter | mm | 209 | 312 | ||
| Grinding Rotation Rate | rpm | 500 – 6000 | |||
| Worktable Rotation Rate | rpm | 10 – 450 | |||
| Y-axis Feed Rate | µm/s | 0.1 – 80 | |||
| Thickness Gauge Resolution | µm | 0.1 | |||
| Acoustic Emission Frequency | kHz | 20–1000 | |||
| Total Power | kVA | 8.3 | 11 | 14 | |
| Total Weight | kgf | 1700 | 1760 | 1920 | |
| Dimension (W×D×H) | mm | 1125×1350×2250 | |||
- All datas are subject to change without notice. Please verify details with Ponda.
Features
1. Microporous Ceramic Chuck Table
The ceramic material, sintered at high temperatures, forms uniform “ant-nest” structures for even vacuum force distribution, preventing wafer damage. It is 11.8% stronger than similar ceramics and integrated with the worktable’s sealing module for enhanced precision and stability. Learn More
2. PONDA-X Control Software
PONDA-X is a human-machine interface (HMI) control software designed specifically for the Wafering Series, based on the Windows operating system. The software features an intuitive and straightforward design, enabling users to quickly understand and easily operate the system. Learn More
3. Air Bearing Spindle (Optional)
The air bearing grinding spindle uses dry, clean air through microporous layers to support the rotor shaft against the stator, enabling fast, smooth rotation without contact, ensuring exceptional accuracy and stability. Learn More
4. In-Machine Thickness Gauges
A high-precision thickness gauge ensures consistent grinding precision and accurate offset measurements for wheel wear. PONDA offers three options for monitoring wafer thickness under various grinding conditions. Learn More
- Off Process Contact Gauge (OCG)
- In Process Contact Gauge (ICG) (Optional)
- In Process Non-Contact Gauge (ING) (Optional)
5. Acoustic Emission (Optional)
A built-in Acoustic Emission (AE) system in a grinding spindle is a sophisticated in-process monitoring tool that detects high-frequency sounds produced during the grinding process. Learn More
6. TAIKO Grinding (Optional)
After the TAIKO grinding process, the raised ring on the wafer’s back acts like a frame, reducing warpage and enhancing structural strength. Even with a wafer thickness as thin as 40 µm, operators can handle it by the ring without damage. Learn More
Model Defination
| PDG | Wafer Grinder |
| 1 · 2 | Single Grinding Spindle · Twin Grinding Spindle |
| 100 · 150 · 200 · 300 | Max. Clamping Diameter |
| S | Semi Automatic |
| A · E | Air Bearing Spindle · Electric Spindle |
| T | Equipped with Thickness Gauge |
- For multiple models with similar appearances, only a single model figure will be displayed.