Engineering Intents
- Enables all-in-one, fully automatic grinding and stress-free processing
- Stress-free processing can be selected as DP (Dry Polishing) or CMP (Chemical Mechanical Polishing)
- The four vacuum chucks are driven by an The four vacuum chucks are driven by an aerostatic rotary platform
- Configured with a non-contact Bernoulli end effector
- The stress relief zone and the grinding zone are isolated
- The surface roughness Sa of the output silicon wafer after CMP processing can be less than 0.1 nanometers, and the flatness can be less than 1 micrometer.
Specifications
| Machine Model | Unit | PDG 3200 AT | PDG 3300 AT |
|---|---|---|---|
| Max. Clamping Diameter | mm (inch) | 200 (8) | 300 (12) |
| Grinding Wheel Diameter | mm | 312 | |
| Stress Relief Wheel Diameter | mm | 450 | |
| Grinding Rotation Rate | rpm | 500 – 6000 | |
| Stress Relief Rotation Rate | rpm | 200 – 1000 | |
| Worktable Rotation Rate | rpm | 10 – 450 | |
| Y-axis Feed Rate | µm/s | 0.1 – 80 | |
| Thickness Gauge Resolution | µm | 0.1 | |
| Acoustic Emission Frequency | kHz | 20 – 1000 | |
| Total Power | kVA | 33 | 37 |
| Total Weight | kgf | 7500 | 7900 |
| Dimension (W×D×H) | mm | 1980×3200×2000 | 1980×3650×2000 |
- All datas are subject to change without notice. Please verify details with Ponda.
Features
1. Microporous Ceramic Chuck Table
The ceramic material, sintered at high temperatures, forms uniform “ant-nest” structures for even vacuum force distribution, preventing wafer damage. It is 11.8% stronger than similar ceramics and integrated with the worktable’s sealing module for enhanced precision and stability. Learn More
2. PONDA-X Control Software
PONDA-X is a human-machine interface (HMI) control software designed specifically for the Wafering Series, based on the Windows operating system. The software features an intuitive and straightforward design, enabling users to quickly understand and easily operate the system. Learn More
3. Air Bearing Spindle
The air bearing grinding spindle uses dry, clean air through microporous layers to support the rotor shaft against the stator, enabling fast, smooth rotation without contact, ensuring exceptional accuracy and stability. Learn More
4. Stress Relief System
The Stress Relief System is an additional process station featured in the triple-spindle model, specifically designed to reduce the internal stress within wafers, thereby enhancing the yield of wafer processing. Learn More
5. In-Machine Thickness Gauges
A high-precision thickness gauge ensures consistent grinding precision and accurate offset measurements for wheel wear. PONDA offers three options for monitoring wafer thickness under various grinding conditions. Learn More
- Off Process Contact Gauge (OCG) (Not Available)
- In Process Contact Gauge (ICG)
- In Process Non-Contact Gauge (ING) (Optional)
6. Acoustic Emission (Optional)
A built-in Acoustic Emission (AE) system in a grinding spindle is a sophisticated in-process monitoring tool that detects high-frequency sounds produced during the grinding process. Learn More
7. Bernoulli End Effector (Optional)
The Bernoulli end effector, almost no physical contact (a tiny support point, made of non-marking rubber, will come into contact with the wafer), leverages the effects of airflow to secure objects onto its surface. Learn More
Model Defination
| PDG | Wafer Grinder |
| 3 | Twin Grinding Spindle & Single Polishing Spindle |
| 200 · 300 | Max. Clamping Diameter |
| A · E | Air Bearing Spindle· Electric Spindle |
- For multiple models with similar appearances, only a single model figure will be displayed.