Featured Technology: TAIKO Grinding

TAIKO is a wafer grinding technology, referring to the backside grinding method used in new-generation packaging technologies. Unlike conventional backside grinding, this process leaves the peripheral ring portion of the wafer (approximately 3 mm) intact, while thinning only the inner area of the wafer. By introducing this technology, it is possible to reduce handling risks of ultra-thin wafers and minimize warpage issues.

After the TAIKO grinding process, the raised ring on the back side of the wafer functions likely the same as wafer frame, effectively reducing wafer warpage and enhancing overall structural strength. Even when the wafer thickness is as thin as 40 µm, operators can easily handle it by holding the remaining ring without causing damage. As a result, the wafer only requires tape lamination to protect the circuitry, without the need to mount it on a much larger external wafer frame.