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A high-precision thickness gauge is a crucial component in grinders, directly impacting the consistency of grinding precision. It also offers the significant benefit of providing precise offset measurements for the grinding wheel’s consumption. PONDA provides three sorts of thickness gauges available as options for monitoring wafer thickness under various grinding conditions.
In Process Contact Gauge (ICG)
The in-process (also called in-machine) contact gauge features two precision probes to maintain a constant closed-loop measurement between the wafer and the benchmark (worktable enclosure) during grinding. The difference in height between these two points provides the wafer’s thickness (including UV tape, if applicable).
In Process Non-Contact Gauge (ING)
The Non-Contact Gauge employs infrared technology to assess the wafer’s true thickness by analyzing the volume of ray absorption, reflection, and dispersion. The measurement result does not include the thickness of the UV film or adhesive in its measurements. It is essential for finish polishing and ultra-thin grinding to ensure the safety of the wafer.
Off Process Contact Gauge (OCG)
The off-process contact gauge is used to measure the thickness of a wafer outside of the grinding process itself, typically during the final inspection stages. Users can configure the system to measure any number of points within the wafer. This gauge is suitable for laboratorial scheme.