Engineering Intents
- Double-sided lapping and polishing of the product
- Equipped with pneumatic pressurization unit, with optional hydraulic pressurization
- Products are nested in planetary carrier, rotating while orbiting
- The flatness and parallelism of the processed product are within 10 microns
- Equipped with touchscreen
Specifications
| Machine Model | Unit | PDB 65 LS | PDB 95 LS | PDB 136 LS |
|---|---|---|---|---|
| Diameter of Upper & Lower Disc (OD × ID) | mm | 376 × 158 | 635 × 235 | 965 × 395 |
| Max. Diameter of Workpiece | mm | 125 | 210 | 300 |
| Number of Planet Wheel | mm | 3 ≤ n ≤ 5 | 3 ≤ n ≤ 6 | |
| Min. Processable Thickness | mm | 0.2 ≤ t ≤ 20 | 0.2 ≤ t ≤ 30 | |
| Disc Rotation Rate | rpm | 0 – 60 | 0 – 50 | |
| Planet Wheel Specification | DP12 Z=66 α=20° | DP12 Z=108 α=20° | DP12 Z=152 α=20° | |
| Main Motor | kVA | 0.4 | 5.5 | 7.5 |
| Auxiliary Motor | kVA | 0.125 | 0.6 | 1.5 |
| Total Weight | kgf | 1500 | 2000 | 2700 |
| Dimension (W×D×H) | mm | 750×1020×1930 | 960×1350×2190 | 1340×1690×2650 |
- All datas are subject to change without notice. Please verify details with Ponda.
Features
1. Machine Housing (Optional)
In a high-cleanliness environment, the Dust Proof Housing isolates the internal environment from the external surroundings, thereby protecting both the processing environment and the facility environment. Under this protection, it effectively prevents particles generated during facing and grooving or external dust particles from entering the polishing center and scratching the workpiece.
To address the issue of slury evaporation and potential contamination caused by rising temperatures during processing, the housing ceiling is equipped with an exhaust vent, which can be connected to the facility’s exhaust system.
2. Compatible with Both Lapping and Chemical Mechanical Polishing
Under the same equipment framework, both lapping and chemical mechanical polishing processes can be utilized. If there is a need to switch processing methods later, this can be achieved by replacing the abrasive disc and slurry to transition between lapping and chemical mechanical polishing processes. However, even if lapping and polishing equipment share the same framework, there are still slight differences in configuration. The most straightforward way to distinguish them is by examining the types of slurries and discs used, as well as checking whether the equipment is equipped with a Disc Turning System (DTS).
In common practice, polishing is essentially fine lapping or fine grinding, usually referred to as Mechanical Polishing. Hereby, we employ a Chemical-Mechanical Polishing method instead of relying solely on mechanical polishing, achieving a scratch-free, ultra-nanoscale surface roughness.
Flat Lapping
Flat lapping is a method used for achieving precise surface flattening. Essentially, this process is utilized to enhance the flatness and, in some instances, the smoothness of the item being worked on. The majority of lapping operations involve the use of a powder-slurry and a synthetic metal lapping plate. In specific scenarios, particularly hard materials, such as diamond, undergo dry lapping with abrasive powders. Less frequently, some processes might not use any powder or slurry at all, relying solely on the lapping plate.
When the hardness of the workpiece surpasses HRA 80, lapping can achieve a mirror-smooth surface. This is because the hard material partially neutralizes the abrasive’s effectiveness, leading to a fine removal of the workpiece’s surface that mimics the effect of polishing thus we call it lap-polishing.
Flat Polishing
Flat polishing is a process designed to improve surface roughness. It operates similarly to lapping on the same equipment but differs in the consumables applied. Most polishing processes involve applying a very fine powder slurry to a polishing pad, whereas lapping typically uses coarser powders and a synthetic metal plate. Polishing slurries are categorized into neutral, acid, and alkaline based on the solution’s pH value.
Under microscopic examination, acid and alkaline slurries work by gradually corroding and softening the object’s surface layer, transforming it into a thin film. This characteristic helps the polishing pad and powder to effortlessly remove the layer, achieving an ultra-fine roughness level.
Model Defination
| PDB | Double Sided Lapping & Polishing |
| 6 · 9 · 13 | Disc Diameter |
| 5 · 6 | Number of Carrier |
| L · P | Lapping · Polishing |
- For multiple models with similar appearances, only a single model figure will be displayed.