Updates & Insights
About Us
Product Center
With the rapid evolution of 3D packaging technologies, glass substrates have emerged as a promising material in advanced packaging due to their superior electrical, mechanical,
...With the integration and miniaturization of semiconductor electronic devices, diamond has become an ideal material for semiconductor substrates due to its excellent thermal conductivity and
...In the fabrication of ultra-thin wafer IGBTs, wafer thinning is one of the most critical process steps. After thinning, wafer thickness is typically below 300
...1. Industry Context: The Rise of 3rd Generation Semiconductors As Moore’s Law continues to evolve, third-generation semiconductors—primarily Gallium Nitride (GaN) and Silicon Carbide (SiC)—have become
...Industry Background and Technical Pain Points With the rapid evolution of high-end optical system designs, the demand for ultra-precision aspherical optical components in aerospace, medical
...After undergoing front-end processing and passing wafer probing, wafers transition to back-end processing, beginning with Back Grinding. As a critical operation, back grinding not only
...1. Laser-Assisted Cutting Technology for Glass-Ceramic Freeform Surfaces Glass-ceramics are widely used in aerospace and laser systems, but their high hardness and brittleness cause severe bottlenecks
...IntroductionIn the realms of optical manufacturing and semiconductor wafer mold fabrication, Single Point Diamond Turning (SPDT) is hailed as the ultimate weapon for ultra-precision manufacturing. It
...1. Background and Challenges Due to its excellent infrared transmittance, thermal stability, and mechanical properties, single-crystal silicon has become a core fundamental material in fields such
...Energy Field-Assisted Ultra-Precision Diamond Cutting Technology: Mechanisms, Applications, and Future Prospects Abstract This article focuses on energy field-assisted ultra-precision diamond cutting (UPDC) technology. Addressing the
...What is a Germanium Wafer? Simply put, a germanium wafer is a thin slice fabricated by cutting, lapping, and polishing high-purity single-crystal germanium. It is
...Advanced ceramics refer to inorganic non‑metallic products manufactured from highly controlled, high‑purity raw materials through precision forming and sintering processes. They exhibit exceptional mechanical, electrical,
...We use cookies to enhance your experience on our website. By continuing to browse this site, you consent to our use of cookies. For more information, please review our Cookie Policy.