Updates & Insights

In-Depth Analysis of Core Technologies for TGV Processing and Filling in Glass Substrates

With the rapid evolution of 3D packaging technologies, glass substrates have emerged as a promising material in advanced packaging due to their superior electrical, mechanical,

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rogress and Applications of Ultra-Precision Manufacturing Technology for Diamond Substrates with TTV 0.1 μm

With the integration and miniaturization of semiconductor electronic devices, diamond has become an ideal material for semiconductor substrates due to its excellent thermal conductivity and

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Wafer Thinning Process – Introduction to the Taiko Process

In the fabrication of ultra-thin wafer IGBTs, wafer thinning is one of the most critical process steps. After thinning, wafer thickness is typically below 300

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Advanced Packaging and Ceramic Interposers: The Pillar of Heterogeneous Integration for Power Semiconductors

1. Industry Context: The Rise of 3rd Generation Semiconductors As Moore’s Law continues to evolve, third-generation semiconductors—primarily Gallium Nitride (GaN) and Silicon Carbide (SiC)—have become

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High-Precision Contact On-Machine Inspection Technology and Error Compensation Algorithm for Optical Component Milling and Grinding

Industry Background and Technical Pain Points With the rapid evolution of high-end optical system designs, the demand for ultra-precision aspherical optical components in aerospace, medical

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Wafer Back Grinding: Technological Analysis and Process Optimization

After undergoing front-end processing and passing wafer probing, wafers transition to back-end processing, beginning with Back Grinding. As a critical operation, back grinding not only

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Advances in Ultra-Precision Machining Technologies for Hard-Brittle Materials and Complex Optics

1. Laser-Assisted Cutting Technology for Glass-Ceramic Freeform Surfaces Glass-ceramics are widely used in aerospace and laser systems, but their high hardness and brittleness cause severe bottlenecks

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Ultra-Precision Machining of Optical Aspheres: Trajectory Compensation Technology Based on Normal Error Modeling and Tool Nose Radius Offset

IntroductionIn the realms of optical manufacturing and semiconductor wafer mold fabrication, Single Point Diamond Turning (SPDT) is hailed as the ultimate weapon for ultra-precision manufacturing. It

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High Efficiency and Low Damage: A Novel Short-Flow Ultra-Precision Machining Technology for Complex Curved Single-Crystal Silicon Optical Components

1. Background and Challenges Due to its excellent infrared transmittance, thermal stability, and mechanical properties, single-crystal silicon has become a core fundamental material in fields such

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Ponda Technical White Paper

Energy Field-Assisted Ultra-Precision Diamond Cutting Technology: Mechanisms, Applications, and Future Prospects Abstract This article focuses on energy field-assisted ultra-precision diamond cutting (UPDC) technology. Addressing the

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What is a Germanium Wafer? Unveiling This Critical Material

What is a Germanium Wafer? Simply put, a germanium wafer is a thin slice fabricated by cutting, lapping, and polishing high-purity single-crystal germanium. It is

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What is Advanced Ceramic?

Advanced ceramics refer to inorganic non‑metallic products manufactured from highly controlled, high‑purity raw materials through precision forming and sintering processes. They exhibit exceptional mechanical, electrical,

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