Updates & Insights

Fundamental Understanding of the Ductile Machinability of Fused Silica Under In-Situ Laser-Assisted Diamond Cutting

The Challenge of Cutting Fused Silica Without DamageFused silica has a small ductile-to-brittle transition depth and wears diamond tools severely, so conventional diamond cutting cannot

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Ultrasonic-Assisted Ultra-Precision Turning of Zinc Selenide With Straight-Nosed Diamond Tools

The Challenge of Poisson-Effect Bending in Ultrasonic CuttingOne-dimensional ultrasonic vibration induces a bending vibration in the cutting depth direction through the Poisson effect, and this

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Shoulder Damage Model and Its Application in Single-Point Diamond Machining of ZnSe Crystals

The Challenge of Predicting Shoulder Damage in ZnSeThe shoulder region of ZnSe components machined by diamond turning carries damage that affects the service performance and

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Cutting Mechanism and Parameter Optimization in Ultra-Precision Ductile-Regime Machining of Zinc Selenide Crystals

The Challenge of Anisotropic Brittle Response in ZnSeZinc selenide’s soft-brittle characteristics cause cracks and pits during cutting, and polycrystalline ZnSe adds grain-level anisotropy that further

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Hydroxy Carboxylates as Complexing Agents for Improving CMP Performance of M-Plane Sapphire

The Challenge of Polishing the Difficult M-Plane of SapphireThe M-plane of sapphire is needed for high-efficiency optical and electronic devices, but it is far more

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Effects of Dispersants on Chemical Reaction and Material Removal in Ultrasonic-Assisted CMP of Sapphire

The Challenge of Enhancing the Chemical Contribution in Sapphire CMPSapphire CMP is limited by the weak chemical contribution to the removal, because the material is

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Material Removal Mechanism of Sapphire Polishing With CeO2-Coated Diamond Composite Abrasives

The Challenge of Green Polishing of SapphireSapphire polishing has traditionally depended on strong acids and alkalis that carry a heavy environmental burden, and the aggressive

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Composite Smoothing of CVD Diamond by Surface-Modification-Promoted Dynamic Friction Polishing and CMP

The Challenge of Removing the Initial Roughness of CVD DiamondCVD-grown diamond surfaces start with a roughness that is far too high for optical use, and

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Five-Axis Finish Milling of an Inconel 718 Monolithic Blisk: Parameter Optimization and Tool Life

The Challenge of Finishing Strain-Hardening SuperalloysInconel 718 is the standard material for high-temperature turbine components, but its severe strain hardening and high cutting temperatures make

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Prediction and Compensation of Milling Deformation Errors in Titanium Alloy Integral Blisk Blades

The Challenge of Machining Thin Integral Blisk BladesIntegral blisks are critical to modern aero engines, but their thin, low-rigidity blades with complex boundary conditions deform

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Surface Integrity and Roughness Modeling of Titanium Alloy TC21 Milling Under MQL Lubrication

The Challenge of Machining High-Strength Titanium AlloysTC21 titanium alloy combines high strength with high ductility, making it valuable for aerospace structural components but extremely difficult

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Atomic-Level Flatness on Oxygen-Free Copper by Combined Lapping and CMP with a Non-Corrosive Slurry

The Challenge of Removing the Damage Layer From Oxygen-Free CopperOxygen-free copper (OFC) is used in vacuum, aerospace and electronic applications where surface purity and flatness

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